The principal of a thick film hybrid is similar to that of a resistor network however with the addition of active and passive surface mount components to form a complete functional module. These modules can either be SM, SIL or DIL.
Benefits of hybrids include:
High packing density
Low mass
High power handling
Resistors can be actively trimmed to a fixed circuit performance eliminating the need for Select On Test resistors, or potentiometers.
A cost-effective, fully tested module can be handled and administered as a single component.
Benefits of hybrids include:
High packing density
Low mass
High power handling
Resistors can be actively trimmed to a fixed circuit performance eliminating the need for Select On Test resistors, or potentiometers.
A cost-effective, fully tested module can be handled and administered as a single component.